The issue seems to be that as solder gets hot, and cools, and gets hot, and cools, over and over. It forms tiny cracks in the circuitry, and the seating of the chip. These cracks result in increased resitance on the circuit, as it's trying to bridge tiny gaps through tiny electronic shocks/sparks. Because of the increased resistance there's an increase in heat output.
Problem with Pb-free solder (that's lead btw), is it is well known in the electronics community to have these micro-fissures (they're the little cracks) occur... However, it's cheaper than lead based alternatives, so the industry has pretty much adopted it.
If you cool down the entire circuit (i.e. putting it in the freezer), there's obviously less heat. Electricity flows better at lower temperatures, and therefore the resistance is lowered, albeit temporarily.
By putting it in an oven (which is where ALL YOUR IPHONES have been at LEAST once in their lives) you can 'reflow' the solder joints, and re-seat the chip in the PCB.
The reason there are timing issues with an update is because during a firmware update, Apple (IMO anyway) tries to do far too much all at once. By this I mean, instead of releasing smaller more frequent updates, they release big updates that stress your used and pretty worn PCB for about 15 minutes of constant current. Which in turn creates a lot of heat, which again are part of the cracking.
It's a little like water in a crack in rocks, it freezes, which expands a little, then warms, where it returns to water and condenses. Over time this creates a bigger and bigger gap.
I've tried to explain this as best as I can. If you don't want to give it a go (don't really have much to lose if you have a heat gun and are careful, just don't melt anything), then you don't have to. But if you're in the same boat as most of us, where it tries to search for half a second, then seemingly timeouts, no software fix can ever resurrect it.
The choice is yours really.