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User profile for user: Forever Newbie
Forever Newbie Author
User level: Level 1
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thermal compound for G4 needed ?

I have a Quicksilver G4 (DP 1GHz) which ran trouble free(except CD/DVD Drive) for many years. One fine day I got kernel trap and not co-operating since.

When I press the power on button it lights up momentarily but no chime.
It did work for few hours after few days

I really like to revive it and I have done the following
1. Reset the PMU switch on logic board.
2. Replaced 3.7 Volt battery
3. Reseated all the PCI cards (Video, SCSI card, Ultra SCSI etc)
4. Checked the voltages on Power supply.
5. Cleaned all the dust (lot of it) on the fans and inside the tower.

Now I am planning to re-seat the processor card. For this I need to remove heat sink. I read in a website ( http://www.jcsenterprises.com/Japamacs_Page/Blog/9AE7FE0E-0CF2-4A7C-8003-489B282 582BC.html) that *thermal compound* is a must.

But then in this forum and Apple Service manual I don't see any thermal compound mentioned for Heatsink for Powermac G4.

Now my concern is whether this is recommended step. I don't want to create new problems on top the existing ones.

I call on the experts...:)

Powermac G4 (quicksilver), Mac OS X (10.4.11)

Posted on Jan 20, 2011 5:17 PM

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8 replies
User profile for user: BDAqua
BDAqua
User level: Level 10
239,015 points

Jan 20, 2011 5:32 PM in response to Forever Newbie

Hi, wait for japamac to confirm, but I think this is the best one...

http://www.arcticsilver.com/ceramique.htm

And I think most consider it essential to replace it when re-seating.

EDIT, OOPs, I guess it was Arctic COOLING, MX-2 High-Performance Thermal COMPOUND, Electrically Non-Conductive...

http://tinyurl.com/49u6bnd

Message was edited by: BDAqua
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User profile for user: japamac
japamac
User level: Level 7
24,400 points

Jan 20, 2011 8:34 PM in response to Forever Newbie

Hi-

The manual doesn't mention thermal compound because thermal pads are used.
Anytime the bond of compound or pad is broken, new is required.

Follow my tutorial and use Arctic Cooling MX-2, MX-3 or MX-4.
The DP 1.0GHz processor will appreciate the compound by running a bit cooler than before.

Be sure to completely remove the gray thermal pad, and be sure to apply thermal compound before powering up.
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User profile for user: Forever Newbie
Forever Newbie Author
User level: Level 1
0 points

Feb 5, 2011 10:12 AM in response to japamac

One question about how to apply thermal compound on G4.
I see right now there is small rectangle (thermal pad) and then an outer rectangle with small space inbetween.

Should I just remove the inner rectangle and just apply thermal compound for that spot?

I am guessing the outer one is for protecting the components outside Micro from heat.
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User profile for user: Forever Newbie
Forever Newbie Author
User level: Level 1
0 points

Feb 12, 2011 3:56 PM in response to japamac

Hi Japamac,
Thanks a lot for your help
I did put thermal compound and thought I had my G4 power mac back.
But now I have a dead machine which powered up once or twice.

I am guessing there is seating issue of CPU daughter board.
I did press firmly on the place where CPU pin attach to logic board

So my question instead of trying
1. Removing heatsink
2. Reseat CPU
3. Clean heat sink and apply compound
4. Put the heatsink
5. Pray and turn on the Powermac hoping I get it right this time

Can I just reseat CPU and then place the heatsink on Top and then turn on Power mac with out applying compound just for few minutes?

If it works then I apply comound and then put on heatsink. Then that is it 🙂.

Will the CPU go bad if I dont have compund on heatsink for few minutes..?

Appreciate your help
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thermal compound for G4 needed ?

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