Heat Dissipation on Time Capsule
iMac 24 and Macbook Aluminum, Mac OS X (10.5.8)
iMac 24 and Macbook Aluminum, Mac OS X (10.5.8)
The bottom of a Time Capsule that I've taken apart (it had the self-exploding power-supply feature) was a rubber pad, so I think it's *not* designed to conduct heat out through the non-logo surface, into the surrounding surface.
I'm confused about why it would dissipate more power than a mac mini, unless they have very different internal drives.
I'm confused about whether the mac mini and time capsule have equivalent wireless performance, and I think the chances of getting real information (based on the waffle I got from a shop) are minimal.
I haven't spent a lot of time on this, but have temporarily removed the bottom rubber pad in the past....thinking that would aid in keeping the Time Capsule a bit more cool.
It made no difference at all for my Time Capsule which sits on a desk with plenty of free air space around the device.
I don't have a Mac Mini, so can't comment on any comparision with that device.
I have worked on numerous Time Capsules and here what I have learned: The top of your TC 'appears' to be somehow attached to the sides and perhaps have any vents located within that indention you notice on the outside the entire circumference. No So! There are no holes, vents etc. located around the top portion. The only vents available are around the outer edge of the bottom metal plate that also has the rubber base attached to it.
Most of the heat that is generated within the TC is accumulated at the bottom located about the rear 1/3rd of the unit. The next higher heat location is on the right side of your unit. The issue of heat dissipation of a TC vs. the Mini should not be compared! The Mini (I have worked on) have vent slots at the top and the bottom and the disks used are comparable. As Bob Timmons states 'any additional airspace you can provide at the top and bottom would really be helpful' is the important thing to consider.
Believe it or not...the TC is a great idea; BUT, was designed to function well regarding cooling. I have worked on each type/model of the TC thru the MC344 models and I can say as each model was redesigned, the main logic board kept becoming cooler and cooler. However, I haven't worked on the MD03x models yet and would expect further improvements in them. Whatever you do, Taser_This, keep plently of free air space around that unit....especially the bottom!
Heat Dissipation on Time Capsule