I am proud to say that I successfully rebaked my 8800GS and repasted both the CPU and GPU to their heatsyncs and cranked them down in hopes to lessen heat warping which leads to the solder cracks.
My GPU and CPU run AT LEAST 20F cooler than before. I've had it on for almost an hour now. Compare to yours.
http://img192.imageshack.us/img192/53/screenshot20101212at908.png
It's a little bit of a pain to get to the underside of the logic board, but once you did it a time or two, it gets much easier. (I forgot something and had to go back.)
I baked the GPU at 400F got 12 minutes on foil balls with foil covering the little tiny capacitor that is normally covered with foam. I let if cool for 40 minutes or more before I started to reassemble.
I used Shin Etsu x23 Thermal Paste on the GPU and the surrounding chips (RAM?) and also cleaned and repasted the CPU as well to help keep ambient down a little.
For those out of options and don't find the 2 year old machines worth replacing yet, you might want to give it a shot.